구 매 사 양 서

COMMODITY DESCRIPTION

[품명(Description)] 상/하부 패턴 정렬도 측정 장치 [OVERLAY MEASUREMENT SYSTEM]
품목번호 Item No.	관세분류번호 HSK No.	정부물품분류번호	단위 Unit	수량 Q'ty
1		41111669	System Set	1

᤾ 용도 및 특징

Wafer에 Patten을 형성하는 노광(Photo lithography) 공정에서 광학 장치를 이용해 이전 공정의 Pattern과 현재 공정에서 형성된 Pattern이 정확하게 정렬되어 있는지 설계대로 연결이 되는지 측정하는 장치

- High Throughput (fast MAM)

- Low Cost of Ownership (CoO)

- Real time data output

- Small footprint

᤾ 장비 구성

1. Main System 1 set

2. Wafer loader/unloader 1 set

3. Wafer Pre-aligner 1 set

4. Wafer stage system 1 set

5. Optical system 1 set

᤾ 성능 및 규격

1. EFEM

1) Wafer handler robot: Linear track (Dual arm)

2) Aligner type: X/Y/R (Vacuum): Standard

3) Alignment time: 3 sec or less

4) 300 mm Foup only: 25 slot

5) Load port Q’ty: 3 ea (3-wide)

6) Load port open time: 17 sec (with Mapping)

7) Load port close time: 13 sec (without mapping)

8) Safety system: Light curtain

9) Carrier ID Type: RF (Radio frequency)

2. Metrology

1) Wafer type: 12 in Notch

2) X/Y/T Stage: Default specification

3) w/ Granite table: Active vibration isolation system

4) User interface (K/B, Mouse, 19” Monitor): Metrology rear side: 1 set

5) Safety system: EMO

6) EMS Shield: White Guard ring

7) End effector type: Black blade type

8) Swedge lok W/O Q: Default specification

9) Earthquake restraint kit: Default specification

3. Optical, Illumination, Focus system

1) Auto focus system: Default specification

2) Optical system: Default specification (Multi Focus Imaging System)

3) Camera module: CMOS

4) Objective lens: 5x, 100x

5) Illumination type: Xenon

6) Spectrum wavelength (Color filter): TWD (Tunable Wavelength & Dual band)

7) Tuneable NA: Variable NA

4. Software and peripherals

1) FA Protocol: SECS and GEM

2) Connection: RJ-45 Adapter

3) Interface (HSMS): TCP/IP Ethernet

4) E84 Software (OHT): Meet customer spec

5) E84 Hokuyo device for OHT: Default specification

6) digital image folding measurement system: Default

7) Waferless setup: ARO Function

8) Pattern recognition: Geometric model finder

9) Wafer recovery function: Default specification (Auto)

5. System computer to control equipment

1) OS - Win 7 PRO (ENG): 64 bit

2) Memory (RAM): 64 GB (Option)

3) SSD: 1TB x 2 EA (C:, D: 개별)

4) HDD: 2TB 3.5” x 1 EA

5) Backup system: Acronis backup system

6. Other function

1) 3rd Certification: SEMI S2

2) Remote control system: Syswin (4-ch)

3) Reference wafer: Metro Cal wafer 12”

7. Hardware & Process acceptance criteria

1) Precision (Dynamic x 10 cycles): 0.15 nm (Standard wafer)

2) TIS Mean: 0.05 nm (Standard wafer)

3) TIS 3 Sigma: 0.20 nm (Standard wafer)

4) TMU (Total measurement uncertainty): 0.25 nm

5) Throughput (MAM Time): 0.20 sec (Standard wafer)

6) Marathon test (No fail ≥ 1,000 Wafers)

- Wafer running (Count_Dummy wafer): 1,000

- MTBI (Hr): > 168 Hrs

- MTTR (Hr): < 3 Hrs

- MTBF (Hr): > 1,000 Hrs

7) XYT Stage motion repeatability: ± 0.75 um for 25mm

8) Cleanliness

- Front side of wafer (Particle ≥ 0.065 um): < 10 EA (10 times load & unload, Bare wafer)

- Back side of wafer (Particle ≥ 0.1 um) < 100 EA (10 times load & unload, Bare wafer)

᤾ 악세서리

1. Standard wafer 1 ea

᤾ 기타

1. Installation: H/W & FA Setup (2 weeks)

2. Warranty: 1 year

3. Warranty parts delivery: < 4 hrs (Domestic)

4. Warranty parts stock: 100% Stock(Domestic)

5. Training: 4 Person x 5 Days x 2 Class